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| (R) HS-26C31RH Data Sheet May 27, 2010 FN3401.5 Radiation Hardened Quad Differential Line Driver The Intersil HS-26C31RH is a quad differential line driver designed for digital data transmission over balanced lines and meets the requirements of EIA standard RS-422. Radiation hardened CMOS processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. The HS-26C31RH accepts CMOS signal levels and converts them to RS-422 compatible outputs. This circuit uses special outputs that enable the drivers to power-down without loading down the bus. Enable and disable pins allow several devices to be connected to the same data source and addressed independently. Features * Electrically Screened to SMD # 5962-96663 * QML Qualified per MIL-PRF-38535 Requirements * 1.2 Micron Radiation Hardened CMOS - Total Dose Up to . . . . . . . . . . . . . . . . . . . . 300kRAD(Si) * Latchup Free * EIA RS-422 Compatible Outputs (Except for IOS) * CMOS Inputs * High Impedance Outputs when Disabled or Powered Down * Low Power Dissipation . . . . . . . . . 2.75mW Standby (Max) * Single 5V Supply * Low Output Impedance . . . . . . . . . . . . . . . . . 10 or Less * Full -55C to +125C Military Temperature Range Specifications Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-96663. A "hot-link" is provided on our homepage for downloading. www.intersil.com/military/ Applications * Line Transmitter for MIL-STD-1553 Serial Data Bus Ordering Information ORDERING NUMBER 5962F9666301QEC 5962F9666301QXC 5962F9666301VEC 5962F9666301VXC HS1-26C31RH/PROTO HS9-26C31RH/PROTO 5962F9666301V9A INTERNAL MKT. NUMBER HS1-26C31RH-8 HS9-26C31RH-8 HS1-26C31RH-Q HS9-26C31RH-Q HS1-26C31RH/PROTO HS9-26C31RH/PROTO HSO-26C31RH-Q PART MARKING Q 5962F96 6630QEC Q 5962F96 66301QXC Q 5962F96 66301VEC Q 5962F96 66301VXC HS1- 26C31RH/PROTO HS9- 26C31RH/PROTO TEMP. RANGE (C) -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 PACKAGE 16 LD SBDIP 16 LD FLATPACK 16 LD SBDIP 16 LD FLATPACK 16 LD SBDIP 16 LD FLATPACK PKG. DWG. # D16.3 K16.A D16.3 K16.A D16.3 K16.A 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2000, 2008, 2010. All Rights Reserved Satellite Applications FlowTM (SAF) is a trademark of Intersil Corporation. All other trademarks mentioned are the property of their respective owners. HS-26C31RH Pinouts HS1-26C31RH (16 LD SBDIP) CDIP2-T16 TOP VIEW AIN 1 AO 2 AO 3 ENABLE 4 BO 5 BO 6 BIN 7 GND 8 16 VDD 15 DIN 14 DO 13 DO 12 ENABLE 11 CO 10 CO 9 CIN AIN AO AO ENABLE BO BO BIN GND HS9-26C31RH (16 LD FLATPACK) CDFP4-F16 TOP VIEW 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD DIN DO DO ENABLE CO CO CIN Logic Diagram ENABLE ENABLE DIN CIN BIN AIN DO DO CO CO BO BO AO AO All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 2 FN3401.5 May 27, 2010 HS-26C31RH Die Characteristics DIE DIMENSIONS: 96.5 mils x 195 mils x 21 mils (2450 x 4950) INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) Thickness: 10kA 1kA Metallization: M1: Mo/TiW Thickness: 5800A M2: Al/Si/Cu (Top) Thickness: 10kA 1kA Substrate: AVLSI1RA Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): VDD ADDITIONAL INFORMATION: Worst Case Current Density: <2.0x105A/cm2 Bond Pad Size: 110mx100m Metallization Mask Layout HS-26C31RH (16) VDD (16) VDD (15) DIN (14) DO (13) DO (12) ENABLE (11) CO (10) CO CIN (9) (1) AIN AO (2) AO (3) ENABLE (4) BO (5) BO (6) BIN (7) GND (8) 3 GND (8) FN3401.5 May 27, 2010 |
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